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2025nian,bandaotixingyesandajishuredian

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2025年,半导体行业三大技术热点

suizheshichanggenshangrengongzhinengyingyongderiyizengzhang,bandaotixingyejiangzai2025nianzaigonglvyuanjian、xianjinfengzhuanghehbmfangmianqudetupo。

bianyi|bandaotichanyezongheng

suizheshichanggenshangrengongzhinengyingyongderiyizengzhang,bandaotixingyejiangzai2025nianzaigonglvyuanjian、xianjinfengzhuanghehbmfangmianqudetupo。

zaizhunbeijinru 2025 nianzhiji,jishujixuyiqiansuoweiyoudesudufazhan。suizhekejixingyedebianhua,bandaotixingyeyezaifashengbianhua,gaixingyezhengzaizhuanxingyizhichixindeyingyong。youyubandaotiyizhishijishuchuangxindehexin,dianziyuanjiandechuangxinduiyuqudongxiayidaizhinengshoujiherengongzhineng (ai) zhiguanzhongyao。

suizhebutongxingyelingyuchuxianxinqushi,quanqiushichangjiangzaiweilaiyinianheshinianneifashengzhongdazhuanbian。zheixiequshijiangyingxiangbandaotideshejifangshiyijitamenxuyaonaxiegongnenglaibangzhuxinchanpinzaijishulingyujuyoujingzhengli。

rengongzhineng,zuoweidangjinkejilingyudewangzhe,jiangzai 2025 nianjiweilaijinianjixusuzaodianziyuanjiangongyinglian。

人工智能助力HBM定制化兴起

rengongzhinengdekuaisufazhanshiguoquliangnianbandaotichuangxinzuizhongyaodequdonglizhiyi。zaizhengge 2025 nian,rengongzhinengjiangjixurongrugengguangfandeshebeizhong,liru 2024 niandituichude pc。tedingzujianlingyuduidingzhidexuqiuriyizengzhang,yinqilezhenggebandaotixingyedexingqu。

liru,nvidia、intelheamdyizhifuzeshejiyi ai weizhongxindechuliqi,baokuo gpu he cpu。zheixiezujianzhuanmenzhenduiziranyuyanchuli、shenduxuexiheshengchengxiangyingjinxingleyouhua。zaiweilaijinian,womenkeyiqidaizheixiezujianshixianchuangxin,caiyonggengjuchuangxinxingdeshenjingxingtaisheji,mofangleisirenleidanaodegongneng。

raner,qunianrenmenduigaodaikuanneicun (hbm) deguanzhudubuduantigao,yinweitadegongnengshiqichengweidaxingyuyanmoxing (llm) kaifarenyuanderemenxuanze。youyugongyingyuelaiyuejinzhang,zhizaoshangtourulegengduochannengheziyuanlaikaifa hbm,congerdailailexindedingzhihuaxuqiu。

sanxingbandaotifuzongcaijian dram chanpinguihuazhuguan indong kim taolunle hbm zai ai yingyonglingyudenenglisuodailaidexinfazhan。

kim biaoshi:“hbm jiagouzhengzaixianqiyigudalangchao——dingzhi hbm。ai jichusheshidejizengxuyaojigaodexiaolvhehengxiangkuozhannengli,womenyuzhuyaokehudachengleyizhi,jijiyu hbm de ai dingzhijiangshiguanjiandeyibu。ppa——gonglv、xingnenghemianjishi ai jiejuefangandeguanjian,erdingzhijiangzai ppa fangmiantigongjudadejiazhi。”

skhailishi、sanxingdianzihemeiguangkejishihbmdesandazhizaoshang,tamenzhengzaitansuotigaoqixingnenghechulisududexinfangfa。

sanxinghemeiguang“zaimeigetukuaicengmianshangdoucaiyonglefeidaodianbomo(ncf)hereyajianhe(tcb)”,er sk hailishize“jixucaiyongdaozhuangxinpiandaguimohuiliugongyidemosudibutianchong(mr-muf),gaigongyizhixuyibujikejiangduizhanmifengzaigaodaodianxingmosucailiaozhong。”

suizheyuelaiyueduoderengongzhinengchulizhuanyidaobianyuan(gengkaojinshujuyuan),weibianyuanshebeishejidebandaotijiangxuyaogengjieneng、gengkuai,bingnenggouchulifuzaderengongzhinenggongzuofuzai。zheiyiqushixuyaodigonghao、gaoxingnengxinpiandechuangxin,youqishiduiyuzhinengxiangji、wulianwangshebeihezidongwurenjidengyingyong。

先进封装将成为芯片创新的下一阶段

churengongzhinengwai,kaifaxindexianjinfengzhuanggongyiyichengwei 2024 nianderemenhuatizhiyi。bandaotixingyezhengzaimianlinmoerdinglvdezhongjie,moerdinglvji“jichengdianlushangjingtiguandeshuliangmeiliangnianfanyifan,erchengbenshangshengfuduhenxiao”。

suizhejiedianchicunyuelaiyuexiao,ocm zhengzaitansuotongguofengzhuangtigaoxinpianxingnengdeqitaxuanze。nvidia yizhizailiyongtaijidiandexianjinfengzhuangnenglilaibangzhutigaoxinpianxingneng。zheishitongguotaijidiandejingyuanjibanxinpian (cowos) shixiande,takeyitigaoxingneng、jianshaozhanyongkongjianbingtigaonengxiao。

cowos tongguozaidangejibanshangduidiexinpianlaicujinbandaotichuangxin。xianzaixianjinjiedianyijiejindangenamichicun,xinpianduidiekaifashibandaotinenglidexiayigechangshi。cowos jishudeyoushijiqikuaisukuozhandenengliquebaoleqizaidaguimoshengchanzhongdeguangfanyingyong。

zheixiefangmianjidadiyouliyurengongzhinengyingyongriyizengzhangdexuqiu,baokuoshengchenghedaxingyuyanmoxing (llm)。taijidianjihuazaikuodaqiquanqiuyewudetongshi,tigaoqixianjinfengzhuangyewudechanneng。juchuan,taijidianjihuazaimeiguoheribenjianlixinde cowos xianjinfengzhuanggongchang,yimanzuzheiyiriyizengzhangdexuqiu。

gaizhanlvebeihoudezhuyaodongjishirengongzhinengyingyongdui nvidia xinpiandexuqiuriyizengzhang。

tongyang,cowos jishudexiaochicunyouzhuyuzaisanreqihezhouliufengshanshejidengxianjinlengquejiejuefanganzhongshixiangenggaoxiaodereguanli。suizheshujuzhongxindekuozhangyimanzuriyizengzhangde ai shiyong,zheikenenghuidaozhiduixianjinfengzhuangyingyongdexuqiuzengjia。

juyanjiu,cowos jishudechixujichengjiangbangzhu ocm tupoxinpianfengzhuangdechuantongxianzhi,tongguotigaoxingnenghezengqianghulianxinglaigaishanyingyong。tongyang,neicun(youqishi dram he nand shancun)zhong 3d duidiedeshiyongliangyejiangzai 2025 nianzengzhang,yigenghaodizhichi ai yingyong。

数据中心的增长将推动电源组件需求激增

suizherengongzhinengbuduanrongrubutongdeyewuheshichanglingyu,shujuzhongxinchengzaizheixiexinxidexuqiuyezaibuduanzengjia。suizherengongzhinengxuqiudezengjia,shujuzhongxinxingyehenkuaiyudaoleyigezhongdawenti,zhuyaoshiyinweidianlihuokongjiangenbenbugou。

zai cnbc deyifenbaogaozhong,zhuanjiajinggaocheng,rengongzhinengyingyongduidianlidexuqiubuduanzengzhang,qiqianzaizengzhangqianlijuda,yizhiyudangeshujuzhongxindeyongdianliangkenengbiyixiedachengshishenzhizhenggemeiguozhoudouyaoduo。

rengongzhinengdegaoxuqiudaozhilingbujianchannengxiajiang,daozhidingzhilengquexitongdejiaohuoshijianbijinianqianyanzhangle 5 beiyishang。shenzhibeiyongfadianjidejiaohuoshijianyechaoguoletongchangdeyigeyuedaoliangnian。

zirengongzhinengbaofayilai,dianlihenengyuanyichengweizuituchudeduanquelingyuzhiyi。guoqujinian,dianqihuagongzuojinyibujiajuleduidianlidexuqiu。dianwangshimeigeguojiajingji、guojiaanquanyijishequjiankangheanquandezhizhu,youyuzhongduoxingyedexuqiubuduanzengzhang,dianwangdewendingxingbiandeyuelaiyuecuiruo。

geguodianwangdaduoyiyoushushinianlishi,shiyongshoumingwei 50-80 nian,jijiangjieshu。dianwanglaohuadaozhiqigengrongyishoudaotingdian、wangluogongjihuoshequjinjiqingkuangdeyingxiang。pulinsidundaxuejiaoshoujiexi·zhanjinsi (jesse jenkins) biaoshi,2030 niandedianlixuqiukenengbi 2021 niangaochu 14%-19%。

21 shijidedianwangbixumanzubuduanzengzhangdedianlixuqiu,weidiandongqiche、rebeng、gongyedianqihuaheqingdianjietigongdongli,bingqiexuyaoyanshendaogaiguodexindiqu,yiliyongzuijiadefengnenghetaiyangnengziyuan。zheilianggeyinsuyiweizhewomenxuyaoyigegengdadedianwanghegengduodezhangjulichuanshu。

zheigewentizhengzaituidongdianyuanyuanjianxingyedexinfazhan。gaoxiaodianyuanzhuanhuanqijiangliyongbichuantongguijiyuanjiangenggaoxiaodexincailiao,bangzhujianshaoshujuzhongxindenengyuansunhao。zheixiecailiaobaokuotanhuagui (sic) hedanhuajia (gan) yuanjian,tamenjuyougenggaodejichuandianya、gengkuaidekaiguansudu、genggaodegonglvmiduhegengxiaodechicun。

wolfspeed、yifabandaotiheyingfeilingshisanjiashengchan sic he/huo gan yuanjiandegongsi。wolfspeed shi sic jishudelingdaozhezhiyi,yizhizhiliyukuodaqiquanqiuyingxianglibingtigaoquanqiushengchannengli。tongyang,gan cengjingshiyizhongjinyongyuhangkonghangtianheguofangyingyongdeyuanjian,xianzaiyuelaiyueduodiyongyutongxinheshujuzhongxin。

tongyang,zheixiezujianyouyuqigonglvxiaolvgao,keyibangzhubandaotixingyebichuantongguizujiangengkuaidishixiankechixufazhanmubiao,zuizhongjianshaodianlixuqiu。sic he gan zujiandepaifangliangyediyuchuantonggui,kejiangzuizhongchanpindepaifangliangjianshaogaoda 30%。

zheijiangshiweilaishujuzhongxinjianshedebiyouzhilu,yinweishujuzhongxinduidianlidexuqiujuda,kenenghuizengjiatanpaifang。

半导体行业正在突破创新界限

suizhe 2025 niandelinjin,youyurengongzhinengtuidonglebandaotigejudebiange,bandaotixingyejiangzaisuzaojishuweilaifangmianfahuigengjiaguanjiandezuoyong。hbm dingzhi、xianjinfengzhuanghegonglvyuanjianchuangxinjiangshi 2025 niandeshaoshuqushizhiyi。weileyingduizheixietiaozhan,bandaotigongsibixutouziyujianduancailiao、xinzhizaogongyihechuangxinxinpianjiagou。

quanqiudianziyuanjianfenxiaoshangbixuyikaoqitexujingyinghezuohuobanguanxi、quanqiugongyingshangwangluoheshichangqingbaogongjulaibangzhukehucaigouzheixiejijiangshangshideyuanjian。suizhebandaotixingyeshiyingzheixiequshi,tajiangjixuchengweijuedingweilaishiniandejishutupodeguanjiantuidongyinsu。

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2025年,半导体行业三大技术热点

suizheshichanggenshangrengongzhinengyingyongderiyizengzhang,bandaotixingyejiangzai2025nianzaigonglvyuanjian、xianjinfengzhuanghehbmfangmianqudetupo。

bianyi|bandaotichanyezongheng

suizheshichanggenshangrengongzhinengyingyongderiyizengzhang,bandaotixingyejiangzai2025nianzaigonglvyuanjian、xianjinfengzhuanghehbmfangmianqudetupo。

zaizhunbeijinru 2025 nianzhiji,jishujixuyiqiansuoweiyoudesudufazhan。suizhekejixingyedebianhua,bandaotixingyeyezaifashengbianhua,gaixingyezhengzaizhuanxingyizhichixindeyingyong。youyubandaotiyizhishijishuchuangxindehexin,dianziyuanjiandechuangxinduiyuqudongxiayidaizhinengshoujiherengongzhineng (ai) zhiguanzhongyao。

suizhebutongxingyelingyuchuxianxinqushi,quanqiushichangjiangzaiweilaiyinianheshinianneifashengzhongdazhuanbian。zheixiequshijiangyingxiangbandaotideshejifangshiyijitamenxuyaonaxiegongnenglaibangzhuxinchanpinzaijishulingyujuyoujingzhengli。

rengongzhineng,zuoweidangjinkejilingyudewangzhe,jiangzai 2025 nianjiweilaijinianjixusuzaodianziyuanjiangongyinglian。

人工智能助力HBM定制化兴起

rengongzhinengdekuaisufazhanshiguoquliangnianbandaotichuangxinzuizhongyaodequdonglizhiyi。zaizhengge 2025 nian,rengongzhinengjiangjixurongrugengguangfandeshebeizhong,liru 2024 niandituichude pc。tedingzujianlingyuduidingzhidexuqiuriyizengzhang,yinqilezhenggebandaotixingyedexingqu。

liru,nvidia、intelheamdyizhifuzeshejiyi ai weizhongxindechuliqi,baokuo gpu he cpu。zheixiezujianzhuanmenzhenduiziranyuyanchuli、shenduxuexiheshengchengxiangyingjinxingleyouhua。zaiweilaijinian,womenkeyiqidaizheixiezujianshixianchuangxin,caiyonggengjuchuangxinxingdeshenjingxingtaisheji,mofangleisirenleidanaodegongneng。

raner,qunianrenmenduigaodaikuanneicun (hbm) deguanzhudubuduantigao,yinweitadegongnengshiqichengweidaxingyuyanmoxing (llm) kaifarenyuanderemenxuanze。youyugongyingyuelaiyuejinzhang,zhizaoshangtourulegengduochannengheziyuanlaikaifa hbm,congerdailailexindedingzhihuaxuqiu。

sanxingbandaotifuzongcaijian dram chanpinguihuazhuguan indong kim taolunle hbm zai ai yingyonglingyudenenglisuodailaidexinfazhan。

kim biaoshi:“hbm jiagouzhengzaixianqiyigudalangchao——dingzhi hbm。ai jichusheshidejizengxuyaojigaodexiaolvhehengxiangkuozhannengli,womenyuzhuyaokehudachengleyizhi,jijiyu hbm de ai dingzhijiangshiguanjiandeyibu。ppa——gonglv、xingnenghemianjishi ai jiejuefangandeguanjian,erdingzhijiangzai ppa fangmiantigongjudadejiazhi。”

skhailishi、sanxingdianzihemeiguangkejishihbmdesandazhizaoshang,tamenzhengzaitansuotigaoqixingnenghechulisududexinfangfa。

sanxinghemeiguang“zaimeigetukuaicengmianshangdoucaiyonglefeidaodianbomo(ncf)hereyajianhe(tcb)”,er sk hailishize“jixucaiyongdaozhuangxinpiandaguimohuiliugongyidemosudibutianchong(mr-muf),gaigongyizhixuyibujikejiangduizhanmifengzaigaodaodianxingmosucailiaozhong。”

suizheyuelaiyueduoderengongzhinengchulizhuanyidaobianyuan(gengkaojinshujuyuan),weibianyuanshebeishejidebandaotijiangxuyaogengjieneng、gengkuai,bingnenggouchulifuzaderengongzhinenggongzuofuzai。zheiyiqushixuyaodigonghao、gaoxingnengxinpiandechuangxin,youqishiduiyuzhinengxiangji、wulianwangshebeihezidongwurenjidengyingyong。

先进封装将成为芯片创新的下一阶段

churengongzhinengwai,kaifaxindexianjinfengzhuanggongyiyichengwei 2024 nianderemenhuatizhiyi。bandaotixingyezhengzaimianlinmoerdinglvdezhongjie,moerdinglvji“jichengdianlushangjingtiguandeshuliangmeiliangnianfanyifan,erchengbenshangshengfuduhenxiao”。

suizhejiedianchicunyuelaiyuexiao,ocm zhengzaitansuotongguofengzhuangtigaoxinpianxingnengdeqitaxuanze。nvidia yizhizailiyongtaijidiandexianjinfengzhuangnenglilaibangzhutigaoxinpianxingneng。zheishitongguotaijidiandejingyuanjibanxinpian (cowos) shixiande,takeyitigaoxingneng、jianshaozhanyongkongjianbingtigaonengxiao。

cowos tongguozaidangejibanshangduidiexinpianlaicujinbandaotichuangxin。xianzaixianjinjiedianyijiejindangenamichicun,xinpianduidiekaifashibandaotinenglidexiayigechangshi。cowos jishudeyoushijiqikuaisukuozhandenengliquebaoleqizaidaguimoshengchanzhongdeguangfanyingyong。

zheixiefangmianjidadiyouliyurengongzhinengyingyongriyizengzhangdexuqiu,baokuoshengchenghedaxingyuyanmoxing (llm)。taijidianjihuazaikuodaqiquanqiuyewudetongshi,tigaoqixianjinfengzhuangyewudechanneng。juchuan,taijidianjihuazaimeiguoheribenjianlixinde cowos xianjinfengzhuanggongchang,yimanzuzheiyiriyizengzhangdexuqiu。

gaizhanlvebeihoudezhuyaodongjishirengongzhinengyingyongdui nvidia xinpiandexuqiuriyizengzhang。

tongyang,cowos jishudexiaochicunyouzhuyuzaisanreqihezhouliufengshanshejidengxianjinlengquejiejuefanganzhongshixiangenggaoxiaodereguanli。suizheshujuzhongxindekuozhangyimanzuriyizengzhangde ai shiyong,zheikenenghuidaozhiduixianjinfengzhuangyingyongdexuqiuzengjia。

juyanjiu,cowos jishudechixujichengjiangbangzhu ocm tupoxinpianfengzhuangdechuantongxianzhi,tongguotigaoxingnenghezengqianghulianxinglaigaishanyingyong。tongyang,neicun(youqishi dram he nand shancun)zhong 3d duidiedeshiyongliangyejiangzai 2025 nianzengzhang,yigenghaodizhichi ai yingyong。

数据中心的增长将推动电源组件需求激增

suizherengongzhinengbuduanrongrubutongdeyewuheshichanglingyu,shujuzhongxinchengzaizheixiexinxidexuqiuyezaibuduanzengjia。suizherengongzhinengxuqiudezengjia,shujuzhongxinxingyehenkuaiyudaoleyigezhongdawenti,zhuyaoshiyinweidianlihuokongjiangenbenbugou。

zai cnbc deyifenbaogaozhong,zhuanjiajinggaocheng,rengongzhinengyingyongduidianlidexuqiubuduanzengzhang,qiqianzaizengzhangqianlijuda,yizhiyudangeshujuzhongxindeyongdianliangkenengbiyixiedachengshishenzhizhenggemeiguozhoudouyaoduo。

rengongzhinengdegaoxuqiudaozhilingbujianchannengxiajiang,daozhidingzhilengquexitongdejiaohuoshijianbijinianqianyanzhangle 5 beiyishang。shenzhibeiyongfadianjidejiaohuoshijianyechaoguoletongchangdeyigeyuedaoliangnian。

zirengongzhinengbaofayilai,dianlihenengyuanyichengweizuituchudeduanquelingyuzhiyi。guoqujinian,dianqihuagongzuojinyibujiajuleduidianlidexuqiu。dianwangshimeigeguojiajingji、guojiaanquanyijishequjiankangheanquandezhizhu,youyuzhongduoxingyedexuqiubuduanzengzhang,dianwangdewendingxingbiandeyuelaiyuecuiruo。

geguodianwangdaduoyiyoushushinianlishi,shiyongshoumingwei 50-80 nian,jijiangjieshu。dianwanglaohuadaozhiqigengrongyishoudaotingdian、wangluogongjihuoshequjinjiqingkuangdeyingxiang。pulinsidundaxuejiaoshoujiexi·zhanjinsi (jesse jenkins) biaoshi,2030 niandedianlixuqiukenengbi 2021 niangaochu 14%-19%。

21 shijidedianwangbixumanzubuduanzengzhangdedianlixuqiu,weidiandongqiche、rebeng、gongyedianqihuaheqingdianjietigongdongli,bingqiexuyaoyanshendaogaiguodexindiqu,yiliyongzuijiadefengnenghetaiyangnengziyuan。zheilianggeyinsuyiweizhewomenxuyaoyigegengdadedianwanghegengduodezhangjulichuanshu。

zheigewentizhengzaituidongdianyuanyuanjianxingyedexinfazhan。gaoxiaodianyuanzhuanhuanqijiangliyongbichuantongguijiyuanjiangenggaoxiaodexincailiao,bangzhujianshaoshujuzhongxindenengyuansunhao。zheixiecailiaobaokuotanhuagui (sic) hedanhuajia (gan) yuanjian,tamenjuyougenggaodejichuandianya、gengkuaidekaiguansudu、genggaodegonglvmiduhegengxiaodechicun。

wolfspeed、yifabandaotiheyingfeilingshisanjiashengchan sic he/huo gan yuanjiandegongsi。wolfspeed shi sic jishudelingdaozhezhiyi,yizhizhiliyukuodaqiquanqiuyingxianglibingtigaoquanqiushengchannengli。tongyang,gan cengjingshiyizhongjinyongyuhangkonghangtianheguofangyingyongdeyuanjian,xianzaiyuelaiyueduodiyongyutongxinheshujuzhongxin。

tongyang,zheixiezujianyouyuqigonglvxiaolvgao,keyibangzhubandaotixingyebichuantongguizujiangengkuaidishixiankechixufazhanmubiao,zuizhongjianshaodianlixuqiu。sic he gan zujiandepaifangliangyediyuchuantonggui,kejiangzuizhongchanpindepaifangliangjianshaogaoda 30%。

zheijiangshiweilaishujuzhongxinjianshedebiyouzhilu,yinweishujuzhongxinduidianlidexuqiujuda,kenenghuizengjiatanpaifang。

半导体行业正在突破创新界限

suizhe 2025 niandelinjin,youyurengongzhinengtuidonglebandaotigejudebiange,bandaotixingyejiangzaisuzaojishuweilaifangmianfahuigengjiaguanjiandezuoyong。hbm dingzhi、xianjinfengzhuanghegonglvyuanjianchuangxinjiangshi 2025 niandeshaoshuqushizhiyi。weileyingduizheixietiaozhan,bandaotigongsibixutouziyujianduancailiao、xinzhizaogongyihechuangxinxinpianjiagou。

quanqiudianziyuanjianfenxiaoshangbixuyikaoqitexujingyinghezuohuobanguanxi、quanqiugongyingshangwangluoheshichangqingbaogongjulaibangzhukehucaigouzheixiejijiangshangshideyuanjian。suizhebandaotixingyeshiyingzheixiequshi,tajiangjixuchengweijuedingweilaishiniandejishutupodeguanjiantuidongyinsu。

编译自sourceability

 
本文为转载内容,授权事宜请联系原著作权人。